PARMI SPI system measures Height, Area, Volume and Offset(X & Y) of the Solder paste deposit. The height, area, and volume are calculated by finding a height reference plane from the base area near each pad. It then takes a segmentation of the pad to calculate the height. For more detailed measurement, the “Bare board teaching” function can be used to measure height offset between the reference plane and the pad plane and solder mask. The bare board teaching program is used to calculate the exact volume of solder paste deposit of each pad. Set up is simple and only carried out one time during initial program set up. The Solder Paste deposit offset is measured by considering the gerber data for the stencil mask. Panel shrink rate is also calculated.
The maximum pad size PARMI SPI can inspect is 60mm x 60mm, and minimum fine pitch is 100um. In Wide-Depth mode, 2~3mm solder deposit, component, and even glue inspection is possible.