The PARMI SPI is designed to identify print failures and present this information to improve the print process and overall yield of the process. When the SPI is installed into a new production line it usually immediately discovers print problems. This defect detection should be judged in a positive light and used to immediately identify and eliminate the root cause of the problem. There is a transitional period in the beginning as the engineer gets accustomed to identifying print failures at the beginning of the process instead of at the end of the process. Some customers put in an SPI buffer after SPI to maintain steady production.
According to our many years experience in Solder Paste Inspection and print, there are many influences that can affect the printing process that go beyond the condition of the actual printer settings. Effects such as panel shrink, panel warp, stencil condition, stir condition of solder paste, training, operator skill level to name but a few. PARMI have proven that despite these conditions we can improve print yield to 99.5% by applying exact analysis and rectification. This result has culminated from real-world in-line production results in some of our larger customers. In addition we have eliminated 60% to 70% post reflow defects, and 95% of all solder defects. This in turn has resulted in 5% to 10% increase of total production volume per SMT line. Again, based on real results measured from before and after PARMI SPI introduction to the production line. Furthermore rework related manpower is changed to process innovation.
PARMI SPI is aimed to be a partner and “Solution Provider” for process innovation way beyond the usual reputation of an SPI which only identifies problems. PARMI through trend analysis and huge amounts of easy to interpret intelligence is geared to truly improve your production line and production yield.