The PARMI SPI system is dedicated to detecting and filtering print problems before they pass to the chip-mounter. However, PARMI differs from the competition by also focusing on providing accurate print information feedback and intelligence to improve the printing process and make it stable. PARMI SPI, through its easy to use interface and graphics, is a measurement tool used to decrease print defects and increase print yield. Our team is dedicated to development of SPI and SPC tools to enhance the printing process.
To perform the above tasks the most accurate 3D shape should be acquired from the solder paste and panel surface. The measuring robustness and accuracy of the SPI is of utmost importance due to the variation of shapes, colors and materials on the surface of the panel and solder paste. For this reason an SPI system that delivers good R&R results in a controlled offline test environment can be very creaky and unstable in-line in the real world. PARMI is the only SPI who can supply true in-line accuracy and consistency through its patented Multiple Profile Correlation (MPC) sensor for various objects. The PARMI SPI machine is streets ahead of the competition when installed in-line in the real world.
The PARMI SPI system has many useful tools for the production line operator and engineer to use for monitoring and setting the printer, while most SPI systems in the market are restricted to the detection of defect pads only. The PARMI SPI identifies most inappropriate condition settings on the printer and uses this information to maximize the stabilization of the printing process and improve print yield. Inappropriate conditions include PCB shrink rate, PCB warpage and stencil mask shrink, all of which affect the printing process.
PARMI is dedicated to providing the best solution for zero-defects printing. PARMI continuously uses customer real world feedback to enhance the information that can be used to get your production line to zero-defects.