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Inspection Methodology

Technology Inspection Methodology

Dual Laser Delivering the Industrys Highest Performance

Exclusive SPI design eliminates shadowing

At PARMI, our SPI measuring principle is simple; we deliver 3D technology unlike anyone in the industry. Our SPI systems incorporate an exclusive, 3D dual-laser sheet beam combined with an optical triangulation measuring tool to deliver the industrys finest images with zero distortion from shadowing.

How is this achieved?

Two laser beams are projected from opposite directions to eliminate the risk of shadowing. The beams are then scanned onto the PCB and reflected back to a high-resolution camera (CMOS) to calculate height with X-Y spatial resolution. The result is a highly- accurate 3D model construction. This Multiple Profile Correlation (MPC) is a PARMI exclusive, and provides realistic and easy-to-interpret 3D images without distortion.

The PARMI difference for SPI measurement: 

  • Highly-compatible technology for both standard and non-standard applications
  • Broad application range (bandwidth) that is consistent with virtually all PCB colors and finishes, including HASL
  • Expansive height range of +/- 1 mm (0.040) with optional 2 mm (0.080) for optimal measurement
  • Reduction of false calls by identifying all features including via holes, edge of PCB and routing
  • Extensive inspection includes component balance, height, area, volume, offset, bridge, shape, warp, and stretch/shrink


Real-time processing with the fastest cycle times

PARMI’s sensor head includes a custom CMOS and CPU design that enables all data acquisition and analysis to be managed within the inspection head. This unique feature helps the SIGMA X provide immediate access to image results, and the industry’s fastest cycle times. Because no moving parts within the sensor means better reliability.

Automatic movement for better warp management

Unlike competing SPI machines, the SIGMA X system incorporates real-time Z-axis control to give you better base-line identification.

Z Axis: 

  • Consistently tracks with the surface of the PCB to quickly adjust PCB warp
  • Maintains optimal camera distance for better focus and measurement, and is unaffected by PCB warp


Without Z axis control, measurements are prone to incorrect baseline identification, decreased accuracy, inaccurate 3D images and more false calls. Avoid these problems with SIGMA X.