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Title PARMI to Exhibit at SMT Connect 2019 Date 2019-04-17
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[Show Name] SMT Connect 2019 - International Exhibition and Conference for System Integration in Micro Electronics
[Dates] May 7(Tue)-9(Thu), 2019 09:00 – 17:00
[Venue] Messezentrum Nuernberg, Germany
[Organiser] Mesago Messe Frankfurt GmbH

[PARMI Europe Booth Number] 4325

 

PARMI Co.,Ltd. is going to participate in the SMT Connect 2019 ’, one of the leading international exhibitions for system integration in micro electronics.

 

In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor Packaging) and Xceed BSI(3D AOI for Bottom Side Inspection), PCI 100(2D/3D Conformal Coating Inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

 

PARMI's booth will be located at 4325.