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Support News
Title PARMI to Exhibit at SMT/PCB & NEPCON KOREA 2019 Date 2019-04-17


[Show Name] SMT/PCB & NEPCON KOREA 2019
[Dates] May 15(Wed)-17(Fri), 2019 10:00-17:00 (16:30 on Friday)
[Venue] COEX convention center Hall C,D, KOREA
[Organiser] Reed K. Fairs Ltd.

[PARMI Booth Number] C105


PARMI Co.,Ltd. is going to participate in the SMT/PCB & NEPCON KOREA 2019’, Asia's Leading Exhibition featuring all kinds of Equipment, Materials and Technologies for Electronics Manufacturing and SMT.


In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor Packaging) and Xceed BSI(3D AOI for Bottom Side Inspection), PCI 100(2D/3D Conformal Coating Inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.


PARMI's booth will be located at C105.