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Support News
Title PARMI to Exhibit at NEPCON SOUTH CHINA 2019 Date 2019-07-03




[Dates] Aug. 28(Wed)-30(Fri), 2019 10:00-17:00 (16:30 on Friday)
[Venue] Shenzhen International Convention & Exhibition Center, Futian District, Shenzhen, CHINA
[Organiser] Reed Exhibitions China

[PARMI Booth Number] 1J10


PARMI Co.,Ltd. is going to participate in the NEPCON SOUTH CHINA 2019’, which is an international-standard electronics manufacturing industry show.


In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor) and Xceed BSI(3D AOI for Bottom Side Inspection), PCI 100(2D/3D Conformal Coating Inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.


PARMI's booth will be located at 1J10