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Title PARMI to Exhibit at NEPCON JAPAN 2016 Date 2016-01-13
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PARMI will exhibit in E16-20 at NEPCON JAPAN 2016, scheduled to take place from January 13th to 15th at Tokyo Big Sight in Tokyo, Japan. PARMI will showcase 3D In-line AOI Xceed as well as 3D In-line SPI SigmaX.

During the show, PARMI will highlight the newly developed 3D AOI system XceedXceed 3D AOI system provides the fastest cycle time and maximizes ROI with its capability of detecting all defects and allowing zero escapes. The key feature of Xceed is its use of dual laser technology eliminating shadow area. Dual laser technology also provides clear and accurate 3D images of components up to 40mm high.


 

Launched in 1972, NEPCON JAPAN has grown as an "Electronics Packaging & Production Show" together with the Japanese electronics industry. Adding IC Packaging, PCB and electronic components in 2000, the show has increased its value as an "International Exhibition for Electronics R&D, Design and Manufacturing".