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PARMI

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Title PARMI to Exhibit at NEPCON CHINA 2019 Date 2019-04-17
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[Show Name] NEPCON CHINA 2019 – 28th Electronics R&D,  Manufacturing and Packaging Technology Expo
[Dates] April 24(Wed)-26(Fri), 2019

[Venue] Shanghai World Expo Convention & Exhibition Center, China
[Organiser] Reed Exhibitions 

[PARMI China Booth Number] 1H38

 

PARMI Co.,Ltd. is going to participate in the ‘NEPCON CHINA 2019’, Asia's Leading Exhibition featuring all kinds of Equipment, Materials and Technologies for Electronics Manufacturing and SMT.

 

In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor Packaging) and Xceed BSI(3D AOI for Bottom Side Inspection), PCI 100(2D/3D Conformal Coating Inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

 

PARMI's booth will be located at 1H38.