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Product

Xceed MICROAXIONPRECIONARTION

Ultra-Precision 2D&3D AOI for Wafer Inspection

High-Resolution Color Image

Easy Teaching, Inspection Result Management

Interworking with EFEM

High Precision
Granite X/Y/Z stage

8”, 12” Ringframe Wafer
: Multi Load Port & Dual arm

Stable
Porous Vacuum Chuck

Inspection Items

Wafer Die(Chipping, Contamination, etc.), Bump(Height, Offset, Coplanarity, etc.)

Ultra-Precision 2D&3D AOI for Wafer Inspection

High-Resolution Color Image

Easy Teaching, Inspection Result Management

Interworking with EFEM

High Precision Granite X/Y/Z stage

8”, 12” Ringframe Wafer
: Multi Load Port & Dual arm

Stable Porous Vacuum Chuck

Inspection Items
Wafer Die (Chipping, Contamination, etc.), Bump (Height, Offset, Coplanarity, etc.)