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PARMI to Exhibit at NEPCON CHINA 2021

[Show Name] NEPCON CHINA 2021 [Dates] April 21(Wed)-23(Fri), 2021 [Venue] Shanghai World Expo Exhibition & Convention Center, China [Organiser] Reed Exhibitions China Ltd. [PARMI China Booth Number] 1H-30 PARMI Co.,Ltd. is going to participate in the ‘NEPCON CHINA 2021’, Asia’s Leading Exhibition featuring all kinds of Equipment, Materials and Technologies for Electronics Manufacturing and SMT. In order to show …

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[vol.10] January 2021

💌 HAPPY NEW YEAR! 2020 is the year we started publishing PARMI newsletter. From the first newsletter in April to December 2020, we introduced PARMI’s technology with 9 newsletters. Fortunately, we could receive many inquiries thanks to writing the newsletters, and we could listen more to customer needs and complaints. Thank you for being with the PARMI …

[vol.10] January 2021 Read More »

[vol.9] December 2020

Inspection of Lead Lift of IC in Tray 1.Lead Lift of IC (Integrated Circuit) Components Among the SMT devices, IC components such as QFP (Quad Flat Package) and SOP (Small Outline Package) that are stored in the tray can experience lift and warpage of lead during the copy process due to raw material defects, components …

[vol.9] December 2020 Read More »

[vol.8] November 2020

  Chip Component Teaching Automation 1.What is Component Teaching? Since the launch of our Xceed 3D AOI machine in 2014, PARMI has been improving our programming SW consistently for user convenience. Component teaching is important because it forms the basis for accurate component inspection results, but many users find it time-consuming. Generally, the component teaching …

[vol.8] November 2020 Read More »

[vol.7] October 2020

The Inspection of the Component Surface -Crack, Warpage 1. Background of Introduction If cracks occur on the surface of an SMT device, it will typically be inspected using 2D data. But according to the color of the device surface, there are limits to inspecting defects only with 2D data because of low discrimination. To overcome …

[vol.7] October 2020 Read More »

[vol.6] September 2020

AI OCR Text Inspection 1. What is AI OCR Text Inspection? Text inspection is the most basic and important inspection item when inspecting components of AOI, but false calls occur frequently. PARMI has developed a text inspection method using a deep learning technology (hereinafter “AI OCR”) to increase text recognition rates and reduce false call …

[vol.6] September 2020 Read More »

[vol.5] August 2020

PCB Warpage Measurement 1. What is “PCB Warpage Measurement”? PARMI provides a function to measure the warpage of PCB’s during the solder paste inspection (SPI) and automated optical inspection (AOI) processes. PCB warpage occurs in the process of fabricating PCB’s or in the SMT manufacturing process. It is important to detect PCB warpage in the …

[vol.5] August 2020 Read More »

[vol.4] July 2020

On-the-fly Debugging 1. What is “On-the-fly Debugging”? Sometimes, there are occasions that inline inspections should be stopped for debugging. Since this has a significant impact on the production yield rate, PARMI supports on-the-fly debugging. On-the-fly debugging is a function that debugging in Lane 1 of dual-lane machines does not affect Lane 2 in which the …

[vol.4] July 2020 Read More »