PARMI will be opening an in-house café in our headquarters to improve the welfare of our employees and to facilitate the convenience of our customers. The in-house café will be utilized as a space for community centers and in-house events that reflect an open corporate culture. Luxurious yet vintage wood interiors and plants provide a …
Solder Ball Inspection 1. Solder Ball Application Description Solder ball is a spherical solder that electrically connects between the chip package and the PCB, and is used in the semiconductor packaging process to precisely control the amount of solder. The solder ball has advantages such as superior electrical conductivity compared to the traditional solder application …
Printer Doctor 1. Real Time Printing Process Optimization PARMI 3D SPI SigmaX features a printer setup troubleshooting tool called the Printer Doctor. This program immediately analyzes the solder print quality and provides condition data of squeegee, stencil, board, etc. In the case of defects, it then provides the operator with the potential issue and corrective …
[Show Name] SMT CONNECT 2022 [Dates] May 10(Tue)-12(Thu), 2022 09:00–17:00 [Venue] NürnbergMesse, Germany [Organizer] Mesago Messe Frankfurt GmbH [Booth Number] Hall 4, Stand 107 PARMI is going to participate in the ‘SMT CONNECT 2022’, Europe’s leading exhibition on solutions for electronic assemblies and systems. In order to show the reliability and accuracy of the machine, PARMI will exhibit …
Underfill Inspection 1. Underfill Inspection Underfill is a method of completely filling the bottom of the package with epoxy in the packaging process, to be more resistant to environmental factors such as moisture, temperature variations, and mechanical shock. If the underfill process is defective, it can result in reduced reliability of the end product. Therefore, …
[Show Name] SMART SMT PCB ASSEMBLY 2022 [Dates] April 6(Wed)-8(Fri), 2022 10:00-17:00 (last day until 16:30) [Venue] Suwon Convention Center, Korea [Organizer] J. Expo [Booth Number] H112 PARMI is going to participate in the ‘SMART SMT PCB ASSEMBLY 2022’, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. In order to show the reliability and accuracy of …
Bottom Side Inspection 1. Xceed BSI Xceed BSI (Bottom Side Inspection) is a 2D & 3D AOI machine that inspects the bottom side of the PCB without flipping the board after wave or selective soldering. Since it is not necessary to flip the PCB, it eliminates unnecessary handling of the PCB. The main uses of …
[Show Name] IPC APEX EXPO 2022 [Dates] January 25(Tue)-27(Thu), 2022 [Venue] San Diego Convention Center, San Diego, CA, USA [Organizer] Int’l Printed Circuit Association [Booth Number] 1108 PARMI USA is going to participate in the ‘IPC APEX EXPO 2022’, world’s leading exhibition for electronics R&D, manufacturing and packaging technology. In order to show the reliability and accuracy of …
[Show Name] Nepcon Japan 2022 [Dates] January 19(Wed)-21(Fri), 2022 09:00-18:00 (last day until 16:00) [Venue] Tokyo Big Sight, Japan [Organizer] Reed Exhibitions Japan Ltd. [Booth Number] 19-2 PARMI Japan is going to participate in the ‘Nepcon Japan 2022’, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. In order to show the reliability and accuracy of the …
[Show Name] Productronica 2021 [Dates] November 16(Tue)-19(Fri), 2021 09:00-18:00 (last day until 16:00) [Venue] Am Messesee, 81829 München, Germany [Organizer] Messe München GmbH [PARMI Europe Booth Number] A2.161 PARMI Europe GmbH is going to participate in the ‘Productronica 2021’, world’s leading trade fair for electronics development and production. In order to show the reliability and accuracy of the …
