[Show Name] SMART SMT PCB ASSEMBLY 2023 [Dates] April 5(Wed)-7(Fri), 2023 10:00-17:00 (last day until 16:30) [Venue] Suwon Convention Center, Korea [Organizer] J. Expo [Booth Number] I112 PARMI is going to participate in the ‘SMART SMT PCB ASSEMBLY 2023’, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. In order to show the reliability and accuracy of …
AI Verification PARMI has developed AI Verification, the 4th AI solution series following AI Model Change – AI Teaching – AI OCR. AI Verification is an AI judgment automation function that replaces the operator’s secondary judgment in the Veriworks program for the primary defect inspected by AOI. Supporting components: Chip(C/R), Capacitor, Coil, Connector, IC, …
PARMI Partners with FCI & Univertools Last January, PARMI signed a new sales rep firm contract with FCI and Univertools & Services, which are well known in the Mexican market. Based on the requests of numerous Mexican customers, PARMI will directly improve customer service in order to provide faster and higher quality service. And at …
🎉 HAPPY NEW YEAR During the year 2022, we were able to carry out many activities for the development of the 3D SPI/3D AOI inspection machine with the support and help sent to PARMI. Thank you from the bottom of my heart, and we will continue to deliver a newsletter composed of useful information on …
[Show Name] Nepcon Japan 2023 [Dates] January 25(Wed)-27(Fri), 2023 09:00-18:00 (last day until 16:00) [Venue] Tokyo Big Sight, Japan [Organizer] Reed Exhibitions Japan Ltd. [Booth Number] East Hall 16-2 PARMI Japan is going to participate in the ‘Nepcon Japan 2023’, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. SigmaX : 3D SPI (Solder Pasted Inspection) Xceed …
[Show Name] IPC APEX EXPO 2023 [Dates] January 24(Tue)-26(Thu), 2023 [Venue] San Diego Convention Center, San Diego, CA, USA [Organizer] Int’l Printed Circuit Association [Booth Number] 2147 PARMI USA is going to participate in the ‘IPC APEX EXPO 2023’, World’s leading exhibition for electronics R&D, manufacturing and packaging technology. SigmaX : 3D SPI (Solder Pasted Inspection) Xceed : …
AI Model Change PARMI has developed a new programming feature called ‘AI Model Change’ which functions in combination with PARMI’s ‘AI Teaching’ SW, a programming automation function. AI Model Change is a function that automates PCB model creation and changes by automatically recognizing new ePM PadX files even during inspection. When an AOI programmer …
[Show Name] SMTA International 2022 [Dates] November 02(Wed)-03(Thu), 2022 [Venue] Minneapolis Convention Center, Minnesota, USA [Organizer] SMTA [Booth Number] Hall B, Stand 910 PARMI is going to participate in the ‘SMTA International 2022’, Europe’s leading exhibition on solutions for electronic assemblies and systems. In order to show the reliability and accuracy of the machine, PARMI USA will …
SPI-AOI Linkage Analysis Determining the root cause of a defect which occurred during the manufacturing process, is critical to prevent recurrence of the defect. PARMI’s SigmaX SPI and Xceed AOI inspection systems obtain the whole image of the PCB and the defect data. Data accumulated through this process allows tracing which process is causing the …
Foreign Materials/Surface Contamination Inspection of PCB Assemblies 1. Foreign Materials/Surface Contamination Foreign materials or scratches during the manufacturing process contaminate the PCB surface and can cause various issues. Such issues include pattern defects, pinholes, and electrical malfunction, which reduces product reliability and yield. Therefore, it is essential to minimize the particles and contamination on the …
