Technology
Technology
SPI │ AOI │ Semiconductor
PARMI’s Unique 3D SPI Strength
1. Perfect 3D Imaging of PCB
- 3D imaging regardless of color, material, and surface roughness
- Accurate 3D image profiling with laser centroid measurement technology
2. Real-Time PCB Warpage Tracking
- Accurate measurement of warpage by scanning the entire area of the PCB with PARMI’s exclusive technology
- Base acquisition by the real-time Z-axis control and PCB scanning
- Guaranteed measurement accuracy for warpage up to ± 5mm
3. Provide and Compensate Data of PCB Stretch and Shrinkage Rate
- Calculate the stretch and shrinkage rate of the PCB by comparing its fiducial mark coordinate value based on the gerber data
4. Real-Time Closed Loop System
- Optimization of SMT process through real-time feedback and feedforward
– Feedback System : Feedback the location information between the PCB and the stencil mask to the printer
– Feedforward System : Feedforward the location information of solder paste to the chip mounter
5. Printer Doctor
- PARMI’s know-how accumulated over many years in the screen printing process
: ‘Fast identification and correction of screen printer setup errors’, ‘root cause analysis’, ‘defect prevention’, and ‘process trend analysis’ - Maximization of printing process stability and production yield
PARMI’s Unique 3D AOI Strength
1. Industry Leading Cycle Time
- Industry’s fastest inspection speed : 65 cm2/sec
- The world’s only dual laser line beam scan method
2. Perfect Inspection of All Kinds of Defect
- High-quality full 3D imaging on the entire PCB for inspection
- Defect detection regardless of PCB color, material, and surface roughness
Missing
Misalignment
Wrong Dimension
Side Mount
Upside Down
Tombstone
Lift
Solder Joint
Pin
Color Band
Lead Missing
Lead Misalignment
Lead Lift
Bridge
Text
Polarity
3. Component and PCB Surface Inspection by a Single Scan
- Inspection of foreign material and contamination both in and out of gerber data (dropped chip, solder ball, foreign material, etc.)
- No impact on inspection time, no additional teaching required for 100% FOD inspection of the PCB
Foreign material
Contamination
4. Real-Time PCB Warpage Tracking
- Accurate measurement of warpage by scanning the entire area of the PCB with PARMI’s exclusive technology
- Base acquisition by the real-time Z-axis control and PCB scanning
- Guaranteed measurement accuracy for warpage up to ± 5mm
5. Accurate Inspection up to 65mm Tall Components
- Inspection up to 65mm height of component using multi-step scanning method
- Industry’s best height measurement capability & height accuracy
6. 100% Shadow Effect Removal
- Dual lasers mounted at extremely steep projection angle
- 3D imaging of low components adjacent to high ones
7. Offline Debugging / Non-Stop Debugging
- Offline debugging
: Image collection in real time for defects that occur during the inspection and debugging using images - Non-stop debugging
: For the dual lane machine, lane 2 can be inspected without being affected during teaching and debugging in lane 1 - Enhanced machine utilization rate and production efficiency
8. NG/Good Master Function
- Locking feature to block general inspection if not testing NG/Good Master PCB
- Management of inspection history for NG/Good Master PCB (SPC)
PARMI’s Unique Semiconductor Strength
1. Industry Leading Cycle Time
- Extremely fast laser scanning method
- Industry’s fastest inspection speed : 15 cm2/sec
2. Utilization in Various Semiconductor Processes
- SiP, Tiny chips (0201~ : metric), Semiconductor materials (e.g. Die, Lead Frame, Bump, IGBT, etc.), and other components inspection
- Wire bonding inspection (e.g. Ball, Foot, Tail, Loop, etc.)
SiP
0201 Chip
Lead Frame
Solder Bump
IGBT Wire
Sagging Wire
3. Precise 2D/3D Image
- High-quality 3D image
- Inspection regardless of surface roughness and shape
4. Convenient Teaching and Debugging
- Wizard-based programming
- Intuitive UI (User Interface)
- Rapid debugging
