1. Inspection irrelevant of Color, Material, and Surface Roughness
Height acquisition regardless of color, material, and surface roughness with highly focused and uniform line beams to measure the entire surface of the object
SiP
Die
Lead Frame
Underfill
Connector Pin
Solder ball
Wave Soldering
IGBT Wire
Pin
Press Fit
SiP
Die
Lead Frame
Underfill
Solder paste
Solder ball
Wave Soldering
IGBT Wire
Pin
Press Fit
2. 3D Imaging of Laser Profiles using MPC (Multi Profile Correlation)
Height acquisition of the object by PARMI’s unique laser profiling technology to measure the exact base
3. PCB Warpage Inspection with the Real-time Z-axis Tracking Function
The industry’s first utilization of the real-time Z-axis for PCB warpage inspection
Optimized for Z-axis control with the industry’s lightest, most-compact sensor head (3.5kg)
Real-time Warpage Tracking
Real-time Warpage Tracking
4. 3D Imaging of High Components by Multi-Step Scanning Function
Z-axis measurement to prevent images of components higher than 5mm from getting blurry
5. Perfect Shadow Effect Removal
Shadow effect removal by using dual lasers with narrow projection angles
6. Minimization of Image Distortion Caused by External Environment After Soldering
PARMI’s TRSC sensor head featuring a short exposure time
No image distortion by high-temperature PCBs immediately after soldering
No influence of external light interference
High-Temperature PCB
Flashlight
High-Temperature PCB
Flashlight
Measuring Principle of Laser Scanning Method
Different position measurement of the projected linear laser depending on the height of the object
Calculation of the height with the center of the measured laser for 3D imaging