Product
Product
Semiconductor

Xceed MICRO
Ultra-Precision 3D AOI for Semiconductor Packaging

AXION
Ultra-Precision 3D AOI for Semiconductor Packaging with Loader/Unloader

PRECION
Ultra-Precision 2D&3D AOI for Wire Bonding with Loader/Unloader

ARTION
Ultra-Precision 2D&3D AOI for Wafer Inspection

Xceed MICRO
Ultra-Precision 3D AOI for Semiconductor Packaging

AXION
Ultra-Precision 3D AOI for Semiconductor Packaging with Loader/Unloader

PRECION
Ultra-Precision 2D&3D AOI for Wire Bonding with Loader/Unloader

ARTION
Ultra-Precision 2D&3D AOI for Wafer Inspection