Product

Product

Xceed BSIPCI 100

3D AOI for
Bottom Side Inspection

Laser Line Scan Method

Fastest Inspection Speed
in the Industry

Immediate Inspection
Without Flipping Process

Specialized in THD Pin, Wave or Selective Soldering, SMD Inspection

Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time

Inspection Items

THD Pin, Wave or Selective Soldering, SMD, etc.

3D AOI for Bottom Side Inspection

Laser Line Scan Method

Fastest Inspection Speed in the Industry

Immediate Inspection Without Flipping Process

Specialized in THD Pin, Wave or Selective Soldering, SMD Inspection

Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time

Inspection Items
THD Pin, Wave or Selective Soldering, SMD, etc.