News
Machine Learning in 3D AOI: Enhancing Defect Detection with AI
As SMT and EMS manufacturing becomes more complex, traditional rule-based 3D AOI inspection often struggles to detect every defect reliably. Variations in component shapes, circuit layouts, print quality, and character
Reducing False Calls in 3D AOI:How PARMI’s Automated Tools Transform SMT Quality Control
False calls—cases where AOI marks good units as defects—are a major challenge in SMT production. They trigger repeated reviews, unnecessary re-inspections, and lower overall line efficiency. As new models and
Integrated 3D SPI and Screen Printer Control: The Value of Closed Loop Functionality
3D SPI plays a crucial role in stabilizing SMT printing quality by integrating directly with the screen printer through a Closed Loop system. Instead of serving as a simple inspection
Laser vs. Moiré: Choosing the Right 3D Sensor Technology
In 3D inspection systems used for SMT, semiconductor, and precision electronics, two major sensing methods dominate: PMP (Phase Measuring Profilometry) and LOT (Laser Optical Triangulation). While both measure height, their
3D SPI: The Importance of Height Measurement in SMT
In Surface Mount Technology (SMT), the first step is solder paste printing. If solder paste is not deposited in the correct position with the proper amount and thickness, defects will
3D AOI vs 2D AOI: Defining the Next Standard in Inspection Technology
1. Difference in Inspection Principles 2D AOI relies on flat images to perform fast and simple inspections. However, without height information, it often misses three-dimensional defects such as solder bridges,
Understanding 3D SPI (Solder Paste Inspection)
PARMI’s 3D SPI solution, SigmaX, is designed to inspect solder paste printing quality at the very first stage of the SMT process. If the proper amount of solder paste is
Understanding 3D AOI (Automated Optical Inspection)
3D AOI is a core inspection system in electronics manufacturing, used to verify components mounted on printed circuit boards (PCBs). Traditional 2D AOI relies on flat image analysis, making it