Product
Product
Xceed MICRO │ AXION │ PRECION │ ARTION
Xceed MICRO │ AXION │ PRECION │ ARTION


Ultra-Precision 3D AOI for Semiconductor Packaging

Extremely Fast and High-Resolution Laser Line Scan Method

Perfect Inspection even for Highly Specular Surfaces

Inspection Irrelevant to Color, Material, Surface Roughness

Inspection Items
SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.

Ultra-Precision 3D AOI for Semiconductor Packaging

Extremely Fast and High-Resolution Laser Line Scan Method

Perfect Inspection even for Highly Specular Surfaces

Inspection Irrelevant to Color, Material, Surface Roughness

Inspection Items SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.
