Product
Product
Xceed MICRO │ AXION │ PRECION │ ARTION
Xceed MICRO │ AXION │ PRECION │ ARTION
Ultra-Precision 3D AOI for Semiconductor Packaging
Extremely Fast and High-Resolution Laser Line Scan Method
Perfect Inspection even for Highly Specular Surfaces
Inspection Irrelevant to Color, Material, Surface Roughness
Inspection Items
SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.
Ultra-Precision 3D AOI for Semiconductor Packaging
Extremely Fast and High-Resolution Laser Line Scan Method
Perfect Inspection even for Highly Specular Surfaces
Inspection Irrelevant to Color, Material, Surface Roughness
Inspection Items SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.
