Product

Product

Xceed MICROAXIONPRECIONARTION

Ultra-Precision 3D AOI for Semiconductor Packaging

Extremely Fast and High-Resolution Laser Line Scan Method

Perfect Inspection even for Highly Specular Surfaces

Inspection Irrelevant to Color, Material, Surface Roughness

Inspection Items

SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.

Ultra-Precision 3D AOI for Semiconductor Packaging

Extremely Fast and High-Resolution Laser Line Scan Method

Perfect Inspection even for Highly Specular Surfaces

Inspection Irrelevant to Color, Material, Surface Roughness

Inspection Items
SiP, Die Attach, Underfill, Solder paste and Bump, Cu Clip on Die, IGBT, etc.