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PARMI to Exhibit at JPCA Show 2026

[Show Name] JPCA SHOW 2026
[Dates] June 10th (Wed) – June 12th (Fri)
[Venue] Tokyo Big Sight, Japan
[Organizer] Japan Electronics Packaging and Circuits Association (JPCA)
[Booth Number] 1A-25

PARMI will participate as an exhibitor at JPCA Show 2026,
a leading exhibition for PCB and electronics manufacturing technologies in Asia.

The exhibition brings together global companies and industry professionals to showcase the latest technologies and industry trends.

At the exhibition, PARMI will showcase its major inspection equipment and demonstrate its advanced technologies and inspection solutions through live equipment demonstrations.

 

  • Xceed II MICRO IGBT : 3D AOI  for IGBT inspection, supporting 75–500㎛
  • Xceed II MICRO : 3D AOI for Semiconductor Packaging
  • Xceed II DSI : Double Side Inspection 3D AOI
  • PCI 100 DSI : Conformal Coating Inspection 2D AOI (option : CTS)