News

News

PARMI to Exhibit at NEPCON ASIA 2026

[Show Name] NEPCON ASIA 2026
[Dates] October 27th (Tue) – October 29th (Thu)
[Venue] Shenzhen World Exhibition & Convention Center 

[Organizer] RX Global
[Booth Number] #13D30

PARMI will participate in EFX 2026, a leading electronics manufacturing exhibition held in Stuttgart, Germany.

EFX brings together a wide range of technologies and solutions across the electronics manufacturing industry, covering key industry trends such as process control, digitalization, and automation.

At the exhibition, PARMI will showcase inspection solutions including 3D SPI and 3D AOI, along with live equipment demonstrations to highlight its technologies for improving quality control and inspection efficiency in production processes.

  • Xceed : 3D AOI
  • Xceed DSI : Doubld Side Inspection 3D AOI
  • Xceed II : Next Generation 3D AOI
  • SigmaX : 3D SPI