[Show Name] SMART SMT PCB ASSEMBLY 2022
[Dates] April 6(Wed)-8(Fri), 2022 10:00-17:00 (last day until 16:30)
[Venue] Suwon Convention Center, Korea
[Organizer] J. Expo
[Booth Number] H112
PARMI is going to participate in the ‘SMART SMT PCB ASSEMBLY 2022’, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology.
In order to show the reliability and accuracy of the machine, PARMI will exhibit the following list of machines and demonstrate excellent technology to its customers by operating its equipment directly on the spot.
- SigmaX : 3D SPI (option : SJD)
- Xceed : 3D AOI
- Xceed MICRO : 3D AOI for semiconductor packaging
- Xceed BSI : 3D AOI for bottom side inspection
- Xceed DSI : Double side inspection with the internal flipper
- PCI 100 : 3D AOI for conformal coating inspection (option : Coating thickness inspection)
PARMI’s booth will be located at H112.