[vol.21] October 2022

Foreign Materials/Surface Contamination Inspection of PCB Assemblies

1. Foreign Materials/Surface Contamination
 Foreign materials or scratches during the manufacturing process contaminate the PCB surface and can cause various issues. Such issues include pattern defects, pinholes, and electrical malfunction, which reduces product reliability and yield. Therefore, it is essential to minimize the particles and contamination on the PCB surface during production.
The laser Line-Scan method of PARMI’s Xceed (3D AOI) scans the entire PCB surface and acquires data. Because it generates base data for the entire PCB, it is possible to detect foreign materials/contamination on not only the parts, but also on the surface of the PCB.

2. Inspection Method
 Xceed (3D AOI) uses 2D images and 3D data to perfectly detect foreign materials/contamination. When the base plane is created after the PCB scan, a brightness measurement (2D) for contamination detection and a height measurement (3D) for foreign object detection is performed. The brightness measurement is based on the gray scale range set by the operator, and the height measurement is based on the minimum height range set within the contamination ROI. As 2D and 3D data can be generated with a single scan and 100% foreign material/contamination inspection can be simultaneously performed, additional cycle time and programming time is not required.



1. Xceed IPC-CFX Qualification
 PARMI obtained IPC-CFX qualification regarding our Xceed 3D AOI and is now registered in the IPC-CFX-2591 Qualified Products List (QPL). This accreditation officially certifies the defect data traceability and real-time optimization of the Xceed product line. In the future, PARMI will provide Smart Factory solutions with enhanced M2M compatibility.