Newsletter

[vol.20] September 2022

LED Distance Measurement 1. LED Distance Measurement  If a manufacturer pursues only a high amount of light without considering the light distribution pattern of vehicle headlights, it may cause problems with glare to the driver in the opposite lane and cause an accident. In order to ensure the safety of the driver, for automotive headlights, …

[vol.20] September 2022 Read More »

[vol.19] August 2022

PARMI Partners with Mactech PARMI, a global leader in the PCB inspection machine sector, has partnered with Mactech to support customers in Argentina. Mactech (formerly under the name Macon) is an established and well respected distributor of SMT equipment based in Buenos Aires and Rio Grande, Argentina. With over 40 years of experience and expertise, …

[vol.19] August 2022 Read More »

[vol.18] July 2022

PARMI MES  Production environments require increasing levels of automation, standardization, and efficiency, and related technologies are fast evolving. The MES (Manufacturing Execution System) is one of the solutions to these needs. Data analytics/management capabilities of MES provide detailed information about the manufacturing environment, which can help the management make faster decisions.  PARMI MES is a …

[vol.18] July 2022 Read More »

[vol.17] June 2022

Solder Ball Inspection 1. Solder Ball Application Description  Solder ball is a spherical solder that electrically connects between the chip package and the PCB, and is used in the semiconductor packaging process to precisely control the amount of solder. The solder ball has advantages such as superior electrical conductivity compared to the traditional solder application …

[vol.17] June 2022 Read More »

[vol.16] May 2022

Printer Doctor 1. Real Time Printing Process Optimization  PARMI 3D SPI SigmaX features a printer setup troubleshooting tool called the Printer Doctor. This program immediately analyzes the solder print quality and provides condition data of squeegee, stencil, board, etc. In the case of defects, it then provides the operator with the potential issue and corrective …

[vol.16] May 2022 Read More »

[vol.15] April 2022

Underfill Inspection 1. Underfill Inspection  Underfill is a method of completely filling the bottom of the package with epoxy in the packaging process, to be more resistant to environmental factors such as moisture, temperature variations, and mechanical shock. If the underfill process is defective, it can result in reduced reliability of the end product. Therefore, …

[vol.15] April 2022 Read More »

[vol.14] January 2022

Bottom Side Inspection 1. Xceed BSI  Xceed BSI (Bottom Side Inspection) is a 2D & 3D AOI machine that inspects the bottom side of the PCB without flipping the board after wave or selective soldering. Since it is not necessary to flip the PCB, it eliminates unnecessary handling of the PCB. The main uses of …

[vol.14] January 2022 Read More »

[vol.13] October 2021

Multi-Lines Verification 1.Veriworks A program for 2nd judgement of defects identified by the inspection machine, handled by an operator. Judgement by the operator, through a comparison between NG image and known good image. Can be linked with an MES system Inspection machine : Xceed, Xceed BSI, Xceed MICRO (1) Main viewer : showing Good image …

[vol.13] October 2021 Read More »

[vol.12] July 2021

  AI Auto Teaching 1.AI Auto Teaching  Customers introducing AOI inspection to their facility will spend a lot of time building their initial component library. Also, depending on the extent of the developed components library, the time required for teaching new models also varies. It takes about 1 to 2 hours for an experienced person …

[vol.12] July 2021 Read More »

[vol.11] April 2021

Solder Bump Inspection 1.Solder Bump Inspection  Solder bump is a conductive bump that connects a chip or die to a PCB or substrate. If a solder bump is defective, this can produce a defect in the product due to the inability for the bump to electrically connect between chip and substrate. A reliable 3D AOI …

[vol.11] April 2021 Read More »